The state government of Odisha signed a Memorandum of Understanding on Friday with Intel Corporation and 3D Glass Solutions Inc. USA in Santa Clara, California, to develop an advanced packaging glass core substrate production plant here, a significant step toward the state's goal of becoming India's semiconductor hub.
The project is expected to cost over USD 3.3 billion, making it one of the nation's biggest investments in high-tech manufacturing. It is suggested that the facility be situated in the Bhubaneswar-Khurda area.
According to official sources, the project would be carried out gradually over a period of five to six years. It will concentrate on manufacturing high-density interconnect substrates, advanced packaging glass core substrates, and related semiconductor technologies, with Intel providing process and technological support.

It is anticipated to provide substantial indirect employment within the larger manufacturing and technology ecosystem in addition to approximately 1,800 direct high-skilled employment opportunities.
The signing of the Memorandum of Understanding was observed by Chief Minister Mohan Charan Majhi, Union Minister for Electronics and IT Ashwini Vaishnaw, Intel Corporation CEO Lip-Bu Tan, and other authorities. Speaking virtually at the event, the chief minister declared that the signing of the Memorandum of Understanding marks the start of a new phase in Odisha's development narrative.
This project extends beyond the production of semiconductors. The goal is to make Odisha a globally competitive location for cutting-edge technology, innovation, AI infrastructure, data centers, and digital transformation in the future, he stated.

The chief minister stated that the new project will firmly establish Odisha on the global semiconductor map and that the government's objective is to foster a thriving ecosystem that generates world-class opportunities for the youth.
He continued, "This is a transformative, generational opportunity that will accelerate economic growth, strengthen India's technological self-reliance, and position Odisha at the forefront of the global digital economy."
According to Majhi, this initiative strengthens the state's commitment to creating a globally competitive semiconductor, electronics, artificial intelligence, and digital infrastructure ecosystem that will support both domestic priorities and international markets. It is in line with Odisha Vision-2036 and India's vision of Atmanirbhar Bharat.

The deal, according to Vaishnaw, marks a turning point in the nation's attempts to grow the whole semiconductor manufacturing ecosystem. According to him, the arrival of companies like Applied Materials Inc., Lam Research, Tokyo Electron Ltd., Merck Electronics, and the signing of the Memorandum of Understanding between Tata Electronics and the multinational Dutch company ASML is an indication of the industry's confidence in India and the Center's efforts in the semiconductor sector.
Attending the signing of the Memorandum of Understanding, Chief Secretary Anu Garg stated that it was a turning point in Odisha's development as a major force in the production of innovative semiconductors and electronics. "Odisha is prepared to make a significant contribution to India's semiconductor aspirations with strong policy support, skilled talent, and integrated infrastructure," she stated.

According to Babu Mandava, CEO of 3D Glass Solutions, this initiative has the potential to make India a major global hub for semiconductor packaging and advanced glass substrates, supporting high-growth industries like artificial intelligence, high-performance computing, and next-generation electronics.
"Intel Foundry is proud to collaborate with 3DGS in exploring this opportunity with the government of Odisha," stated Naga Chandrasekaran, executive vice-president and general manager of Intel Foundry.